What is a Porous chuck?

Porous chucks have the ability to absorb objects to be measured and processed, and are used in inspection equipment and dicing saws. By using negative pressure and porous structure on the surface of the table, thin silicon wafers can be held flat. When used with a dicing saw, silicon wafers are cut at a width of 10 to 20 micrometers, so parallelism and flatness are required for the silicon wafer adsorption surface. It excels at adsorbing and fixing thin objects without damage or deformation.

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