What is a Build-up board?

A build-up substrate is a type of multilayer PCB (Printed Circuit Board) made by stacking multiple layers of material. Unlike traditional PCBs, which are designed with all components and wiring on a single layer, build-up substrates employ a method where additional layers are added on top of each other. This technique enables the creation of high-density, multifunctional circuits. Each layer contains different circuits, which are connected individually to form highly complex systems. Build-up substrates are commonly used in products that require intricate circuit designs, such as smartphones, communication devices, and medical equipment.

Application of Build-up board

✅Smartphone Circuit Design
Smartphones require complex circuits to fit into limited space. Using build-up substrates allows for efficient placement of these circuits, improving performance while saving space.
✅High-Density Circuits for Communication Devices
Communication devices demand smaller and more powerful circuits. Build-up substrates enable circuit designs that optimize the internal space of the device, resulting in better performance.
✅Medical Equipment Use
High-density circuits are essential for precision medical equipment. Build-up substrates are used to achieve miniaturization and enhance performance in these critical applications.
✅Automotive Electronic Control Systems
Automotive electronic control systems are highly complex and multifunctional. Using build-up substrates allows for efficient circuit designs that enhance both performance and reliability in vehicles.

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