What is a CMP equipment / Chemical Mechanical Planarization device?

A CMP system (Chemical Mechanical Planarization system) is an equipment used in semiconductor manufacturing to planarize the surface of a wafer through a combination of chemical and mechanical processes. This device is essential for achieving a flat and uniform surface, which is necessary for the creation of fine semiconductor circuits.

In the CMP process, a slurry containing abrasives and chemicals is applied to the wafer surface, and a rotating polishing pad is used to mechanically polish and flatten the surface. This results in a uniform, smooth surface where multiple layers of metal and insulating films can be precisely patterned. CMP is particularly important for creating multi-layered interconnects and transistors.

CMP systems play a crucial role in semiconductor manufacturing and are indispensable for producing high-performance chips.

Application of CMP equipment / Chemical Mechanical Planarization device

CMP systems are used in various applications in semiconductor manufacturing. Here are some specific examples:
１．Multi-layer Interconnects in Semiconductor Chips: CMP systems are used in the fabrication of multi-layer interconnects in semiconductor chips. They help planarize multiple layers of metal and insulating films, ensuring precise creation of fine circuits.
２．Memory Device Manufacturing: In the production of memory devices such as DRAM and flash memory, CMP systems are used to precisely planarize different layers. This ensures accurate placement of transistors, enhancing the performance of the memory device.
３．Post-Photolithography Planarization: After the photolithography process, an uneven film may form on the wafer surface. CMP systems are used to smooth and planarize this film, improving precision for the subsequent steps in the manufacturing process.

※Includes information on some trading companies