What is a Bonding wire?

Bonding wire is a very thin metallic wire used to electrically connect the chip of a semiconductor device to its substrate or package. Typically made from materials such as gold (Au), aluminum (Al), copper (Cu), or palladium (Pd), the wire has a diameter ranging from a few microns to tens of microns. These wires are employed in a process called wire bonding, where they establish both a physical and electrical connection between the semiconductor chip and its package.

Bonding wires are used in various bonding methods, including thermo-compression bonding, ultrasonic bonding, and thermosonic bonding. In these processes, one end of the wire is bonded to the bonding pad of the semiconductor chip, and the other end is connected to the terminal of the substrate, completing the electrical circuit.

Bonding wires are used in a variety of electronic devices, including semiconductors, LEDs, MEMS, and power devices. With the trend toward miniaturization of circuits, the selection of the appropriate wire material and bonding method plays a crucial role in ensuring the performance and durability of these devices.

Application of Bonding wire

Here are some specific examples of bonding wire applications:
１．Smartphone Processor Chip Connection: The processor chip in a smartphone is connected to the substrate using bonding wires. This allows the internal circuits of the chip to link with the substrate, enabling the device's processing power and communication capabilities.
２．LED Manufacturing: LED chips are connected to substrates or packages using bonding wires. This connection enables the necessary current to flow into the LED chip, allowing it to emit light.
３．Automotive ECU (Electronic Control Unit): In automotive applications, bonding wires are used to connect semiconductor chips to the substrate in the Electronic Control Units (ECUs). This connection ensures the functioning of vehicle safety systems and driver assistance features.

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