What is a Ashing device / Ashing Equipment?

Ashing equipment is an essential tool used primarily in semiconductor and electronic device manufacturing processes to remove organic materials or contaminants from surfaces. It is especially important for removing resist, polymers, metal oxides, and other residues left on the surface of wafers and substrates.

The ashing process typically involves the use of oxygen or fluorine-containing gases in a plasma system. These gases chemically react with organic materials on the surface, causing them to oxidize or decompose into gases that are then evacuated from the chamber. Plasma ashing requires high precision to ensure uniform and controlled treatment, as it is often part of the fine fabrication process.

Ashing equipment plays a crucial role in wafer surface treatment, cleaning, and contaminant removal, making it an indispensable step in the production of integrated circuits (ICs) and MEMS (Micro-Electro-Mechanical Systems) devices. For instance, it is used to remove photoresist after photolithography or clean the wafer after etching.

Application of Ashing device / Ashing Equipment

Here are some specific examples of ashing equipment applications:
１．Photoresist Removal After Photolithography: In semiconductor manufacturing, after the photolithography process, photoresist remains on the wafer surface. Ashing equipment is used to remove this resist by using plasma technology, which oxidizes and gasifies the resist to eliminate it from the wafer.
２．Wafer Cleaning After Etching: After the etching process, ashers are used to remove remaining chemicals or contaminants on the wafer surface. This cleaning step ensures that the wafer is prepared for the next step in the fabrication process, preventing any issues caused by residues.
３．Surface Treatment for MEMS Devices: In the production of MEMS (Micro Electro Mechanical Systems) devices, which require highly precise microstructures, ashing equipment is used to eliminate organic materials and impurities from the wafer surface. This improves the accuracy and functionality of MEMS devices.

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