What is a Reflow furnace?

A reflow furnace is a heating furnace for soldering printed circuit boards and electronic components in unit board manufacturing. Since the reflow oven occupies most of the entire reflow equipment, the reflow oven is sometimes called the reflow equipment.
The temperature of the reflow oven is raised to about 150 ° C to 230 ° C when the board is mounted. In addition, some solders contain lead and some do not, and the operating temperature range varies depending on the solder used.

Application of Reflow furnace

The reflow furnace is used as a heating furnace for soldering printed circuit boards and electronic components in unit board manufacturing. It is mainly used as the main function in reflow equipment. When soldering parts to a printed circuit board, there is a method of actually bonding electronic parts by hand using a soldering iron, but when the number of parts is large or the bonding surface with the electronic parts to be bonded is extremely small. Is a very difficult task. In recent years, due to the high integration of circuits, the size of mounted components has become smaller and the mounted components have become denser, and there are concerns that soldering by hand may cause insufficient adhesion or short circuits. Therefore, by using a reflow device that enables precise surface mounting, reliable board assembly becomes possible.

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